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2309 results:
  • 551. Publications / Patents
    Date: 18.05.2021
    2010 A. Schneider, H. Rank, A.Trautmann, Eutectic wafer bonding for 3-D integration, IEEE Electronic System-Integration Technology Conference, (2010), 1-6.
  • 552. Publications / Patents
    Date: 18.05.2021
    2007 S.Kamiya, J.Kuypers, A.Trautmann, P.Ruther, O.Paul, Process Temperature Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure, IEEE Journal of Microelectromechanical Systems 16 Issue 2, (2007), 202 – 212. B. Levey, P. Gieschke, M. Dölle, S. Spinner, A. Trautmann, P. Ruther, O. Paul, CMOS-Integrat
  • 553. Publications / Patents
    Date: 18.05.2021
    2006 A.Trautmann, R.Denfeld, F.Heuck, P.Ruther, O.Paul, Novel Silicon Microneedle Stamps for Allergy Skin Prick Testing, Proc. MEMS’06, Istanbul, (2006), 434-437.
  • 554. Publications / Patents
    Date: 18.05.2021
    2005 M.Schuster, N.Klein, P.Ruther, A.Trautmann, O.Paul, P.Kuzel, F.Kadlec, An interconnected 2D-TM EBG structure for millimetre and sub-millimetre waves, IEEE Journal on Selected Areas in Communication, Vol.23, No.7, (2005), 1378-1384. P.Ruther, J.Bartholomeyczik, A.Buhmann, A. Trautmann, K.Steffen, O.Paul,  Microelectromechanica
  • 555. Publications / Patents
    Date: 18.05.2021
    2004 S.Kamiya, J.Kuypers, A.Trautmann, P.Ruther, O.Paul, Annealing Temperature Dependent Strength of Polysilicon Measured Using a Novel Tensile Test Structure, Proc. MEMS’04, Maastricht, (2004), 185-188. M.Schuster, N.Klein, P.Ruther, A.Trautmann, O.Paul, P.Kuzel, F.Kadlec, An interconnected 2D-TM EBG structure for millimetre and sub-millim
  • 556. Publications / Patents
    Date: 18.05.2021
    2003 A.Trautmann, P.Ruther, O.Paul, Microneedle Arrays Fabricated Using Suspended Etch Mask Technology Combined with Fluidic Through Wafer Vias, Proc. MEMS’03, Kyoto, (2003), 682-685. A.Trautmann, R.Haug, P.Ruther, O.Paul, Robustness of Silicon Microneedle Arrays Penetrating Bulk Material, Proc. Eurosensors XVII, (2003), 414-417.
  • 557. Publications / Patents
    Date: 18.05.2021
    2002 A.Trautmann, P.Ruther, O.Paul, Novel Microneedle Arrays Using Suspended Etch Masks, Proc. Eurosensors XVI, Praque,(2002), 433-436.
  • 558. Publications / Patents
    Date: 18.05.2021
    Patents/Patent applications P1: MICROMECHANICAL METHOD AND CORRESPONDING ASSEMBLY FOR BONDING SEMICONDUCTOR SUBSTRATES AND CORRESPONDINGLY BONDED SEMICONDUCTOR CHIP P2: CONTACT ARRANGEMENT FOR ESTABLISHING A SPACED, ELECTRICALLY CONDUCTING CONNECTION BETWEEN MICROSTRUCTURED COMPONENTS P3: COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATE
  • 559. Publications / Patents
    Date: 16.08.2018
    2013 C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Characterization of Diverse Gate Oxides on 4H-SiC 3D Trench-MOS Structures, Materials Science Forum. 740–742 (2013) 691–694. https://doi.org/10.4028/www.scientific.net/MSF.740-742.691. 2011 L. Bohne, A. Trautmann, T. Pirk, W. Jaegermann, Strukturierung von Siliziumsubstraten für
  • 560. Publications - Publications, Patents and Published Applications
    Date: 09.08.2021
    Publications, Patents and Published Applications 2021 - 2016 M.Y. Jahmani, M.E. Hammadeh, M.A. Al Smadi, M.K. Baller, Label-Free Evaluation of Chromatin Condensation in Human Normal Morphology Sperm Using Raman Spectroscopy, Reprod. Sci. (2021) 1–13. https://doi.org/10.1007/s43032-021-00494-6 M. Gries, A. Christmann, S. Schulte, M. Weyland, S
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