ges ns atio ua ang &L el lR ona ati t. Dep rn Inte Access to Higher Education for International Students I do NOT have a direct university entrance qualification I have a direct university entrance qualification My school leaving certificate is not recognised in Germany I graduated from a German School abroad or I have already studied in
ges ns atio ua ang &L el lR ona ati t. Dep rn Inte Access to Higher Education for International Students I do NOT have a direct university entrance qualification I have a direct university entrance qualification My school leaving certificate is not recognised in Germany I graduated from a German School abroad or I have already studied in
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Relevant excerpts on the subject of entry requirements
Below we list excerpts on the subject of entry requirements fr
AGENS
The Enteric Nervous System Research Group (AGENS) headed by Prof. KH Schäfer (HS KL) has been working for years on the characterization of the ENS in the context of development, changes in disease patterns, or the use of the enteric neural stem cells contained in it.1,2 First indications of an influence of local inflammation on these neural
Current activity:
2017 - current Professor (W2) of Biomedical Metrology, Faculty of Computer Science and Microsystems Engineering (IMST), University of Applied Science Kaiserslautern
Academic Education:
exp. 2021 Habilitation in Physical Chemistry, Faculty of Chemistr
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Alumni
Welcome to the Hochschule Kaiserslautern’s alumni page
The Hochschule Kaiserslautern wishes to offer all graduates a forum that allows them to stay in contact with the university, meet new contacts, exchange specialist knowledge, initiate projects with like-minded individuals, or to simply get back in touch with former classmat
Damascene copper electroplating for chip interconnections by P. C. Andricacos C. Uzoh J. 0. Dukovic J. Horkans H. Deligianni zyxwvutsrqponmlkjihgfedcbaZYXWVUTSRQPONMLKJIHGFED zyxw zyxwvut zyxwvutsr Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interc