New research project "Tissue engineering of cells in complex hydrogels using three-dimensional electrical and magnetic stimulation"
In April 2020, the interdisciplinary joint project "TelMa" will start, in which a total of 9 working groups of the University of Applied Sciences Kaiserslautern will work together to develop new possibilities for rege
2019
M. Woelfer, M. li, L. Colic, T. Liebe, X. Di, B. Biswal, J. Murrough, V. Lessmann, T. Brigadski, M. Walter, Ketamine-induced changes in plasma brain-derived neurotrophic factor (BDNF) levels are associated with the resting-state functional connectivity of the prefrontal cortex. The World Journal of Biological Psychiatry. 21 (2019) Nov 4,
Conference Contributions
D. Clausi, H. Gradin, J. Peirs, S. Braun, R. Donose, G. Stemme, W. Wijngaart, D. Reynaerts, Reliability of Silicon Spring-biased SMA Microactuators, (2012).
H. Gradin, S. Braun, G. Stemme, W. Wijngaart, Awafer-level, heterogeneously integrated, high flow SMA-silicon gas microvalve, 2011 16th Int. Solid-State Sensors,
Dissertation
S. Braun, Wafer-level heterogeneous integration of MEMS actuators. PhD thesis, KTH, Microsystem Technology, (2010). QC20100729.
Based on the following journal publication
D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, W. Wijngaart, Design and Wafer-Level Fabrication of SMA Wire Microactuators on Silicon,
Patents
S. Braun, F. Niklaus, A. Fischer, and H. Gradin, Method for the wafer-level integration of shape memory alloy wires. European Patent Application 2011843548, US Patent US9054224B2, Australia Patent 2011332334, Canada Patent 2818301, WO 2012071003 A1
Publications
2014
C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Influence of Diverse Post-Trench Processes on the Electrical Performance of 4H-SiC MOS Structures, Materials Science Forum. 778–780 (2014) 595–598. https://doi.org/10.4028/www.scientific.net/MSF.778-780.595. C.T. Banzhaf, M. Grieb, A. Trautmann, A.J. Bauer, L. Frey, Inv
2011
L. Bohne, A. Trautmann, T. Pirk, W. Jaegermann, Strukturierung von Siliziumsubstraten für integrierte 3D-Dünnschichtbatterien, MikroSystemTechnik - KONGRESS (2011).
2013
C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Characterization of Diverse Gate Oxides on 4H-SiC 3D Trench-MOS Structures, Materials Science Forum. 740–742 (2013) 691–694. https://doi.org/10.4028/www.scientific.net/MSF.740-742.691.
2007
S.Kamiya, J.Kuypers, A.Trautmann, P.Ruther, O.Paul, Process Temperature Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure, IEEE Journal of Microelectromechanical Systems 16 Issue 2, (2007), 202 – 212. B. Levey, P. Gieschke, M. Dölle, S. Spinner, A. Trautmann, P. Ruther, O. Paul, CMOS-Integrat
