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1865 results:
  • 771. Publications
    Date: 18.05.2021
    Dissertation S. Braun, Wafer-level heterogeneous integration of MEMS actuators. PhD thesis, KTH, Microsystem Technology, (2010). QC20100729. Based on the following journal publication D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, W. Wijngaart, Design and Wafer-Level Fabrication of SMA Wire Microactuators on Silicon,
  • 772. Publications
    Date: 18.05.2021
    Patents S. Braun, F. Niklaus, A. Fischer, and H. Gradin, Method for the wafer-level integration of shape memory alloy wires. European Patent Application 2011843548, US Patent US9054224B2, Australia Patent 2011332334, Canada Patent 2818301, WO 2012071003 A1
  • 773. Publications / Patents - Publications
    Date: 18.05.2021
    Publications 2014 C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Influence of Diverse Post-Trench Processes on the Electrical Performance of 4H-SiC MOS Structures, Materials Science Forum. 778–780 (2014) 595–598. https://doi.org/10.4028/www.scientific.net/MSF.778-780.595. C.T. Banzhaf, M. Grieb, A. Trautmann, A.J. Bauer, L. Frey, Inv
  • 774. Publications / Patents
    Date: 18.05.2021
    2011 L. Bohne, A. Trautmann, T. Pirk, W. Jaegermann, Strukturierung von Siliziumsubstraten für integrierte 3D-Dünnschichtbatterien, MikroSystemTechnik - KONGRESS (2011).
  • 775. Publications / Patents
    Date: 18.05.2021
    2013 C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Characterization of Diverse Gate Oxides on 4H-SiC 3D Trench-MOS Structures, Materials Science Forum. 740–742 (2013) 691–694. https://doi.org/10.4028/www.scientific.net/MSF.740-742.691.
  • 776. Publications / Patents
    Date: 18.05.2021
    2010 A. Schneider, H. Rank, A.Trautmann, Eutectic wafer bonding for 3-D integration, IEEE Electronic System-Integration Technology Conference, (2010), 1-6.
  • 777. Publications / Patents
    Date: 18.05.2021
    2007 S.Kamiya, J.Kuypers, A.Trautmann, P.Ruther, O.Paul, Process Temperature Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure, IEEE Journal of Microelectromechanical Systems 16 Issue 2, (2007), 202 – 212. B. Levey, P. Gieschke, M. Dölle, S. Spinner, A. Trautmann, P. Ruther, O. Paul, CMOS-Integrat
  • 778. Publications / Patents
    Date: 18.05.2021
    2006 A.Trautmann, R.Denfeld, F.Heuck, P.Ruther, O.Paul, Novel Silicon Microneedle Stamps for Allergy Skin Prick Testing, Proc. MEMS’06, Istanbul, (2006), 434-437.
  • 779. Publications / Patents
    Date: 18.05.2021
    2005 M.Schuster, N.Klein, P.Ruther, A.Trautmann, O.Paul, P.Kuzel, F.Kadlec, An interconnected 2D-TM EBG structure for millimetre and sub-millimetre waves, IEEE Journal on Selected Areas in Communication, Vol.23, No.7, (2005), 1378-1384. P.Ruther, J.Bartholomeyczik, A.Buhmann, A. Trautmann, K.Steffen, O.Paul,  Microelectromechanica
  • 780. Publications / Patents
    Date: 18.05.2021
    2004 S.Kamiya, J.Kuypers, A.Trautmann, P.Ruther, O.Paul, Annealing Temperature Dependent Strength of Polysilicon Measured Using a Novel Tensile Test Structure, Proc. MEMS’04, Maastricht, (2004), 185-188. M.Schuster, N.Klein, P.Ruther, A.Trautmann, O.Paul, P.Kuzel, F.Kadlec, An interconnected 2D-TM EBG structure for millimetre and sub-millim
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