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  • 601. Purchase of a heat treatment furnace for the materials science laboratory
    Date: 12.01.2020
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  • 602. Purchase of a heat treatment furnace for the materials science laboratory
    Date: 12.01.2020
    Purchase of a heat treatment furnace for the materials science laboratory The materials science laboratory is equipped with a notched impact hammer and a device for the Jominy face quenching test, which are basic tools in materials science education. Particularly, bcc materials tend to have a strongly temperature-dependent strength behaviour, wh
  • 603. Pump test bay with integrated sensor technology
    Date: 07.09.2020
    Pump test bay with integrated sensor technology: The test bench is suitable for carrying out long-term tests on up to three pumps simultaneously, especially for recording the temperatures of the pumps, the flow rates and the pressures before and after the pumps. By means of a valve it is possible to constrict the pipeline so that the flow resi
  • 604. Pump test bay with integrated sensor technology
    Date: 02.09.2020
    Pump test bay with integrated sensor technology: The test bench is suitable for carrying out long-term tests on up to three pumps simultaneously, especially for recording the temperatures of the pumps, the flow rates and the pressures before and after the pumps. By means of a valve it is possible to constrict the pipeline so that the flow resi
  • 605. Publications / Patents - Publications
    Date: 18.05.2021
    Publications 2014 C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Influence of Diverse Post-Trench Processes on the Electrical Performance of 4H-SiC MOS Structures, Materials Science Forum. 778–780 (2014) 595–598. https://doi.org/10.4028/www.scientific.net/MSF.778-780.595. C.T. Banzhaf, M. Grieb, A. Trautmann, A.J. Bauer, L. Frey, Inv
  • 606. Publications / Patents
    Date: 18.05.2021
    2013 C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Characterization of Diverse Gate Oxides on 4H-SiC 3D Trench-MOS Structures, Materials Science Forum. 740–742 (2013) 691–694. https://doi.org/10.4028/www.scientific.net/MSF.740-742.691.
  • 607. Publications / Patents
    Date: 18.05.2021
    2011 L. Bohne, A. Trautmann, T. Pirk, W. Jaegermann, Strukturierung von Siliziumsubstraten für integrierte 3D-Dünnschichtbatterien, MikroSystemTechnik - KONGRESS (2011).
  • 608. Publications / Patents
    Date: 18.05.2021
    2010 A. Schneider, H. Rank, A.Trautmann, Eutectic wafer bonding for 3-D integration, IEEE Electronic System-Integration Technology Conference, (2010), 1-6.
  • 609. Publications / Patents
    Date: 18.05.2021
    2007 S.Kamiya, J.Kuypers, A.Trautmann, P.Ruther, O.Paul, Process Temperature Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure, IEEE Journal of Microelectromechanical Systems 16 Issue 2, (2007), 202 – 212. B. Levey, P. Gieschke, M. Dölle, S. Spinner, A. Trautmann, P. Ruther, O. Paul, CMOS-Integrat
  • 610. Publications / Patents
    Date: 18.05.2021
    2006 A.Trautmann, R.Denfeld, F.Heuck, P.Ruther, O.Paul, Novel Silicon Microneedle Stamps for Allergy Skin Prick Testing, Proc. MEMS’06, Istanbul, (2006), 434-437.
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