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2588 results:
  • 1981. Publications / Patents
    Date: 18.05.2021
    2006 A.Trautmann, R.Denfeld, F.Heuck, P.Ruther, O.Paul, Novel Silicon Microneedle Stamps for Allergy Skin Prick Testing, Proc. MEMS’06, Istanbul, (2006), 434-437.
  • 1982. Publications / Patents
    Date: 18.05.2021
    2005 M.Schuster, N.Klein, P.Ruther, A.Trautmann, O.Paul, P.Kuzel, F.Kadlec, An interconnected 2D-TM EBG structure for millimetre and sub-millimetre waves, IEEE Journal on Selected Areas in Communication, Vol.23, No.7, (2005), 1378-1384. P.Ruther, J.Bartholomeyczik, A.Buhmann, A. Trautmann, K.Steffen, O.Paul,  Microelectromechanica
  • 1983. Publications / Patents
    Date: 18.05.2021
    2004 S.Kamiya, J.Kuypers, A.Trautmann, P.Ruther, O.Paul, Annealing Temperature Dependent Strength of Polysilicon Measured Using a Novel Tensile Test Structure, Proc. MEMS’04, Maastricht, (2004), 185-188. M.Schuster, N.Klein, P.Ruther, A.Trautmann, O.Paul, P.Kuzel, F.Kadlec, An interconnected 2D-TM EBG structure for millimetre and sub-millim
  • 1984. Publications / Patents
    Date: 18.05.2021
    2003 A.Trautmann, P.Ruther, O.Paul, Microneedle Arrays Fabricated Using Suspended Etch Mask Technology Combined with Fluidic Through Wafer Vias, Proc. MEMS’03, Kyoto, (2003), 682-685. A.Trautmann, R.Haug, P.Ruther, O.Paul, Robustness of Silicon Microneedle Arrays Penetrating Bulk Material, Proc. Eurosensors XVII, (2003), 414-417.
  • 1985. Publications / Patents
    Date: 18.05.2021
    2002 A.Trautmann, P.Ruther, O.Paul, Novel Microneedle Arrays Using Suspended Etch Masks, Proc. Eurosensors XVI, Praque,(2002), 433-436.
  • 1986. Publications / Patents
    Date: 18.05.2021
    Patents/Patent applications P1: MICROMECHANICAL METHOD AND CORRESPONDING ASSEMBLY FOR BONDING SEMICONDUCTOR SUBSTRATES AND CORRESPONDINGLY BONDED SEMICONDUCTOR CHIP P2: CONTACT ARRANGEMENT FOR ESTABLISHING A SPACED, ELECTRICALLY CONDUCTING CONNECTION BETWEEN MICROSTRUCTURED COMPONENTS P3: COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATE
  • 1987. Publications / Patents - Publications
    Date: 18.05.2021
    Publications 2014 C. Banzhaf, M. Grieb, A. Trautmann, A. Bauer, L. Frey, Influence of Diverse Post-Trench Processes on the Electrical Performance of 4H-SiC MOS Structures, Materials Science Forum. 778–780 (2014) 595–598. https://doi.org/10.4028/www.scientific.net/MSF.778-780.595. C.T. Banzhaf, M. Grieb, A. Trautmann, A.J. Bauer, L. Frey, Inv
  • 1988. Pump test bay with integrated sensor technology
    Date: 02.09.2020
    Pump test bay with integrated sensor technology: The test bench is suitable for carrying out long-term tests on up to three pumps simultaneously, especially for recording the temperatures of the pumps, the flow rates and the pressures before and after the pumps. By means of a valve it is possible to constrict the pipeline so that the flow resi
  • 1989. Pump test bay with integrated sensor technology
    Date: 07.09.2020
    Pump test bay with integrated sensor technology: The test bench is suitable for carrying out long-term tests on up to three pumps simultaneously, especially for recording the temperatures of the pumps, the flow rates and the pressures before and after the pumps. By means of a valve it is possible to constrict the pipeline so that the flow resi
  • 1990. Purchase of a heat treatment furnace for the materials science laboratory
    Date: 12.01.2020
    Purchase of a heat treatment furnace for the materials science laboratory The materials science laboratory is equipped with a notched impact hammer and a device for the Jominy face quenching test, which are basic tools in materials science education. Particularly, bcc materials tend to have a strongly temperature-dependent strength behaviour, wh
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