Publications / Patents
Journal Publications
D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, W. Wijngaart, Robust actuation of silicon MEMS using SMA wires integrated at wafer-level by nickel electroplating, Sensors Actuators A-Physical. 189 (2013) 108–116. https://doi.org/10.1016/j.sna.2012.08.036.
H. Gradin, S. Bushra, S. Braun, G. Stemme, W. van der Wijngaart, Wafer-level integration of NiTi shape memory alloy on silicon using Au-Si eutectic bonding, Journal of Micromechanics and Microengineering. 23 (2012) 15008. https://doi.org/10.1088/0960-1317/23/1/015008.
H. Gradin, D. Clausi, S. Braun, G. Stemme, J. Peirs, W. Wijngaart, D. Reynaerts, A low-power high-flow shape memory alloy wire gas microvalve, Journal of Micromechanics and Microengineering, 22 (2012) 75002. https://doi.org/10.1088/0960-1317/22/7/075002.
H. Gradin, S. Braun, G. Stemme, W. Wijngaart, SMA Microvalves for Very Large Gas Flow Control Manufactured Using Wafer-Level Eutectic Bonding, IEEE transactions on industrial electronics 59 (2012) 4895–4906. https://doi.org/10.1109/TIE.2011.2173892.
A.C. Fischer, H. Gradin, S. Schröder, S. Braun, G. Stemme, W. van der Wijngaart, F. Niklaus, Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates, Journal of Micromechanics and Microengineering. 22 (2012) 55025. https://doi.org/10.1088/0960-1317/22/5/055025.
Contact
Studiengangsleitung " Systems Engineering for Micro-Electro-Mechanical-Systems or Biomedical Micro Engineering, Master", Fachbereichsrat IMST, Fachausschuss Studium und Lehre MST
- +49 631 3724-5428stefan.braun(at)hs-kl(dot)de
- Campus Zweibrücken
- Room H144
Conference Contributions
D. Clausi, H. Gradin, J. Peirs, S. Braun, R. Donose, G. Stemme, W. Wijngaart, D. Reynaerts, Reliability of Silicon Spring-biased SMA Microactuators, (2012).
H. Gradin, S. Braun, G. Stemme, W. Wijngaart, Awafer-level, heterogeneously integrated, high flow SMA-silicon gas microvalve, 2011 16th Int. Solid-State Sensors, Actuators Microsystems Conf. TRANSDUCERS’11, IEEE. (2011) 1781–1784. https://doi.org/10.1109/TRANSDUCERS.2011.5969424.
D. Clausi, H. Gradin, S. Braun, J. Peirs, D. Reynaerts, G. Stemme, W. Wijngaart, Wafer-level mechanical and electrical integration of SMA wires to silicon MEMS using electroplating, in: 24th IEEE International Conference on Micro Electro Mechanical Systems (2011) pp. 1281–1284. https://doi.org/10.1109/MEMSYS.2011.5734667.
A. Fischer, H. Gradin, S. Braun, S. Schroder, G. Stemme, F. Niklaus, Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology, in: Proc. IEEE 24th Int. Conf. Micro Electro Mech. Syst. (MEMS), (2011) pp. 348–351. https://doi.org/10.1109/MEMSYS.2011.5734433.
D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, W. Wijngaart, Microactuation Utilizing Wafer-Level Integrated SMA Wires, in: 24th IEEE International Conference on Micro Electro Mechanical Systems, 2009: pp. 1067–1070. https://doi.org/10.1109/MEMSYS.2009.4805571.
N. Sandström, S. Braun, G. Stemme, W. Wijngaart, Full wafer integration of shape memory alloy microactuators using adhesive bonding, in: TRANSDUCERS 2009 : 15th International Conference on Solid-State Sensors, vol. Actuators and Microsystems, (2009) pp. 845–848. https://doi.org/10.1109/SENSOR.2009.5285794.
H. Gradin, S. Braun, M. Sterner, G. Stemme, W. van der Wijngaart, Selective electrochemical release etching of eutectically bonded microstructures, in: 15th IEEE Int. Conf. Solid-State Sensors, Actuators Microsystems (IEEE TRANSDUCERS 2009) 15th Int. Conf. Solid-State Sensors, (2009) pp. 743–746. https://doi.org/10.1109/SENSOR.2009.5285586.
S. Braun, J. Oberhammer, G. Stemme, MEMS crossbar switches for telecommunication networks, (2008).
N. Sandström, S. Braun, T. Grund, G. Stemme, M. Kohl, W. van der Wijngaart, Wafer-Scale Manufacturing of Robust Trimorph Bulk SMA Microactuators, in: ACTUATOR 08, Conf. Proc., (2008) pp. 382–385.
S. Braun, J. Oberhammer, G. Stemme, Smart individual switch addressing of 5×5 and 20×20 MEMS double-switch arrays, in: TRANSDUCERS EUROSENSORS ’07 - 4th Int. Conf. Solid-State Sensors, Actuators Microsystems , IEEE, (2007) pp. 153–156. https://doi.org/10.1109/SENSOR.2007.4300094.
S. Braun, J. Oberhammer, G. Stemme, MEMS single-chip 5x5 and 20x20 double-switch arrays for telecommunication networks, in: IEEE 20th International Conference on Micro Electro Mechanical Systems 2007. MEMS , IEEE, (2007) pp. 811–814. https://doi.org/10.1109/MEMSYS.2007.4433176.
S. Braun, T. Grund, S. Ingvarsdottir, W. Wijngaart, M. Kohl, G. Stemme, Robust Trimorph Bulk SMA Microactuators for Batch Manufacturing and Integration, in: TRANSDUCERS and EUROSENSORS ’07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, (2007) pp. 2191–2194. https://doi.org/10.1109/SENSOR.2007.4300602.
S. Braun, J. Oberhammer, G. Stemme, Mems single-chip microswitch array for re-configuration of telecommunication networks, in: European Microwave Conference : Vols 1-4, IEEE, (2006) pp. 315–318. https://doi.org/https://doi.org/10.1109/EUMC.2006.281043.
S. Braun, S. Haasl, S. Sadoon, A.S. Ridgeway, W. Wijngaart, G. Stemme, Small footprint knife gate microvalves for large flow control, in: Transducers ’05, Digest of Technical Papers, IEEE, Vols 1 and 2 (2005) pp. 329-332 Vol. 1. https://doi.org/10.1109/SENSOR.2005.1496423.
Dissertation
S. Braun, Wafer-level heterogeneous integration of MEMS actuators. PhD thesis, KTH, Microsystem Technology, (2010). QC20100729.
Based on the following journal publication
D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, W. Wijngaart, Design and Wafer-Level Fabrication of SMA Wire Microactuators on Silicon, Journal of microelectromechanical systems, 19 (2010) 982–991. https://doi.org/10.1109/JMEMS.2010.2049474.
H. Gradin, S. Braun, G. Stemme, W. Wijngaart, Localized removal of the Au–Si eutectic bonding layer for the selective release of microstructures, Journal of Micromechanics and Microengineering. 19 (2009) 105014. doi.org/10.1088/0960-1317/19/10/105014.
S. Braun, N. Sandström, G. Stemme, W. van der Wijngaart, Wafer-scale manufacturing of bulk shape-memory-alloy microactuators based on adhesive bonding of titanium-nickel sheets to structured silicon wafers, Journal Microelectromechanical Systems 18 (2009) 1309–1317. https://doi.org/10.1109/JMEMS.2009.2035368
S. Braun, J. Oberhammer, G. Stemme, Single-chip MEMS 5x5 and 20x20 double-pole single-throw switch arrays for automating telecommunication networks, Journal of Micromechanics and Microengineering. 18 (2008) 15014. https://doi.org/10.1088/0960-1317/18/1/015014.
S. Braun, J. Oberhammer, G. Stemme, Row/column addressing scheme for large electrostatic actuator MEMS switch arrays and optimization of the operational reliability by statistical analysis, J. Microelectromechanical Syst. 17 (2008) 1104–1113. doi.org/doi.org/10.1109/JMEMS.2008.928710.
S. Haasl, S. Braun, A. S. Ridgeway, S. Sadoon, W. van der Wijngaart, and G. Stemme, Out-of-plane knife gate microvalves for controlling large gas flows, Journal of microelectromechanical systems, 15 (2006) 1281–1288. https://doi.org/https://doi.org/10.1109/JMEMS.2006.880279.