2025
L.M. Sauer, J.L. Otto, L.A. Lingnau, J.A. Ziman, P. Starke, F. Walther, A test setup to unravel the electrical resistance at creep fatigue on the example of metastable austenite AISI 304L and its diffusion brazed joints, Journal of Materials Research and Technology 35 (2025) 535–544.
F. Weber, F. Weber, A. Bezold, C. Broeckmann, P. Starke,
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Selected Publication
Nguyen VTT, König S, Formes H, Al Taleb Z, Steinert F, Bufe B, Eggert S, Stegmüller S, Schermer Y, Richling E, Kins S, Reinhardt C, Endres K. Monocolonization with Bacteroides thetaiotaomicron exerts region-specific effects on Alzheimer's disease-related traits in the murine brain. Microbiol Spectr. 2026 Jan 2
Prof. Dr.-Ing. Gerd Bitsch • G. Bitsch, K. Dreßler, M. Kleer, E. Pena Vina, Absicherung von Fahrzeugfunktionen unter Berücksichtigung der Umgebung und des Fahrzeugverhaltens, in: DVM, Berlin, 2017: pp. 31–41.
• M. Kleer, G. Bitsch, K. Dreßler, E. Pena Vina, T. Rothmann, Ein neues Konzept zur Erprobung und Absicherung von Gesamtfahrzeugfunkti
Publications of the SQL funding projects 4080 Interviews on the teaching award 3977 Poster contributions to the conference ‘Visions of student success’ 3306 Contributions to the conference proceedings ‘Visions of student success’ 3294
Conference Contributions
D. Clausi, H. Gradin, J. Peirs, S. Braun, R. Donose, G. Stemme, W. Wijngaart, D. Reynaerts, Reliability of Silicon Spring-biased SMA Microactuators, (2012).
H. Gradin, S. Braun, G. Stemme, W. Wijngaart, Awafer-level, heterogeneously integrated, high flow SMA-silicon gas microvalve, 2011 16th Int. Solid-State Sensors,
Dissertation
S. Braun, Wafer-level heterogeneous integration of MEMS actuators. PhD thesis, KTH, Microsystem Technology, (2010). QC20100729.
Based on the following journal publication
D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, W. Wijngaart, Design and Wafer-Level Fabrication of SMA Wire Microactuators on Silicon,
Patents
S. Braun, F. Niklaus, A. Fischer, and H. Gradin, Method for the wafer-level integration of shape memory alloy wires. European Patent Application 2011843548, US Patent US9054224B2, Australia Patent 2011332334, Canada Patent 2818301, WO 2012071003 A1
Most important congress contributions of the last years
11th International Meeting on Substrate-Integrated Microelectrode Arrays; July 2018 Decker, D., Pirrung, M., Gries, M., Ingebrandt, S., Schäfer, K-H., Saumer, M., Rabe, H.. Impedance of 3D Nanostructured MEAs: Influence of Coating and Cell Cultivation
European Neurogastroenterology mee
